Coosea Group Global Supply Chain Conference was Successfully Held in Shenzhen
Coosea Group and MediaTek Signed 5G Strategic Agreement
F3R Won the Global Resources Innovation Award in Hong Kong
Coosea Group Global Supply Chain Conference was held in InterContinental Shenzhen, more than 200 supplier partner companies from all over the world leaders and representatives, nearly 500 people gathered in shenzhen.
Coosea Group and MediaTek formally signed a 5G strategic cooperation agreement, which is a sustained and in-depth cooperation on 5G product development after years of partnership.
Overseas sales team and marketing team of Coosea Group went to Hong Kong, China, to attend the exhibition of the world's biggest electronics show - global sources Mobile Electronics show, which held in Hong Kong AsiaWorld-Expo, the show has more than 3700 booth of mobile devices, 、gathered over 70000 buyers from 150 countries and regions.
The first China International Intelligent Terminal Industry Development Conference was held in Yibin city of Sichuan province. Many heavyweight domestic and overseas guests attend the conference - ambassadors, associations, mobile enterprises, operators, distributors, and other areas of the world's major economic zones and industry. Coosea Group was invited as an important corporate attended, and invited its several international partners and overseas operators
The opening ceremony of koobee Yibin Intelligent Terminal Industrial Park was held in Yibin city, Sichuan province
Coosea and Samsung have signed the cooperation agreement on memory products for five consecutive years
In accordance with the management regulations of the open projects of the center, experts have reviewed the received 2024 open projects.
To promote collaborative innovation in the field of smart terminal motherboard manufacturing in the electronic information industry and drive the transfer and transformation of scientific and technological achievements.
The "Sichuan SMT Printing Engineering Technology Research Center" was approved for construction in 2021, focusing on building an innovation base in related fields.
Download the application form for the open projects of the center in 2024.
To promote theoretical and technological research and innovative applications in the motherboard-related fields of the electronic information industry and facilitate open exchanges.
